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- (4bu) Rational Design of Advanced Organic Materials
Our work has piloted the use of such a rational materials design scheme in the area patterning materials for microelectronics processing. More specifically, we have used a combination of atomistic and mesoscale modeling to guide the design of novel molecular glass photoresist materials that can be used for high resolution patterning in semiconductor fabrication. Conventional state-of-the-art photoresist materials are composed multi-component blends of polymers with small molecule photoacid generators, dissolution inhibitors, and base quenchers. While this design approach has worked for the patterning of multiple generations of smaller and smaller transistors, it can be used for future generations because this design is unable to print features small enough with sufficient smoothness (line edge roughness) and sensitivity. This is especially true since the patterned feature sizes have truly approached the scale of individual polymers. Custom written kinetic Monte Carlo mesoscale simulations of the lithographic process have allowed us to investigate multiple different materials design strategies and processing conditions that lead to greatly improved material performance and helped guide the design of better materials. These simulations not only accurately model current performance; they have successfully predicted the improved performance of new materials. We have also developed thermodynamic models of molecular glass materials that successfully predict the glass transition temperature and accurately predict the full range of dissolution properties of these materials. These models allow the reduction of thousands of candidate materials and conditions to tens of materials. Even if excellent materials are designed, they are only useful if they can be made and made economically. To that end, we have created synthetic strategies that have allowed us to synthesize several generations of these materials, each with improved performance. After modeling and synthesizing new materials, we have improved their performance even further thorough the use of fundamental reaction engineering. By modifying the kinetics of cross-linking of one negative tone resist, the resolution was improved down to 25 nm. This rational design approach has yielded truly superior performing materials.