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Publications
Proceedings
CCPS 17th Annual International Conference and Workshop Risk, Reliability, and Security
General Submissions
TECHNICAL PAPERS
Selective Catalytic Reduction (SCR) System Design and Operations: Quantitative Risk Analysis of Options
2008 Annual Meeting
Session: Plasma Processing and Emerging Applications
Plasma Processing
Chair
Agarwal, S.
, Colorado School of Mines
Co-Chair
Chang, J. P.
, University of California at Los Angeles
Presentations
12:30 PM
(310a) Compositional Tuning of Bimetallic Nanoparticles for Low Temperature Carbon Nanotube Growth
12:48 PM
(310b) Design of a High Throughput Microwave Plasma Reactor for Bulk Production of Metal Oxide Nanowires
01:06 PM
(310c) Modeling Plasma-Surface Interactions and Their Role In Inducing Structural Transitions In Materials
01:24 PM
(310d) 3-Dimensional Monte Carlo Profile Simulation and Experimental Measurements of Surface Roughness Under Plasma Etching
01:42 PM
(310e) Simulation of Profile Evolution In Shallow Trench Formation by Plasma Etching
02:00 PM
(310f) Molecular Dynamics Simulations of Plasma-Surface Interactions: Nanoscale Feature Etching on a Silicon Substrate
02:18 PM
(310g) Stochastic Differential Charging and Its Effects on Charging Damage and Feature Profile Evolution during Plasma Processing
02:36 PM
(310h) Coupling Gas Phase and Surface Reaction Kinetics In C4F8 and SF6 Plasmas Used for Si and SiO2 Etching
