(426b) Fabrication of a Multi-Material Devices Using Novel Slot Die Configurations

Advancements in electronics, membranes, organic solar cells, and fuel cells often necessitate complex structures that require patterning and multilayer designs, which require
cumbersome, expensive fabrication techniques. Traditional fabrication methods for these devices typically involve multiple coating tools, drying chambers, and additional patterning techniques that often require subtractive fabrication steps. Collectively, this leads to extensive equipment and facilities and increases in energy consumption, overall costs, and carbon footprint. To address these challenges, here we present one-step continuous manufacturing to fabricate complex multilayer, multi-material thin film structures using an advanced slot die technique (co-deposition and dual-layer slot die) within a laboratory scale roll-to-roll (R2R) system. The co-deposition slot die enables patterning multiple materials across the web (z-axis), while the dual-layer slot die enables coating multiple materials through the thickness (y-axis). In this work, several conductive inks and non-conductive polymers were fabricated simultaneously. Guided by coating fundamentals, the width and thickness of fabricated thin film were controlled across two or three layers. The electrical properties of the multilayer thin films were found to be comparable with reported values in the field. Additionally, material properties such as layer adhesion were found to be excellent, showing no signs of delamination. Broad implementation of the presented fabrication process for multilayer, multi-material thin film, can lead to faster production rates with significant reductions in infrastructure, energy, and material waste.