(30s) h6 Organometallic Hexagonal Boron Nitride: Functionalization and Prope

Hexagonal boron nitride (h-BN), renowned for its formidable attributes—tensile strength (~100 GPa), wide bandgap (~6 eV), high thermal conductivity (227-280 W.m^-1.K^-1), and chemical stability—poses a challenge in functionalization due to its electronegativity variance between boron and nitrogen. In a breakthrough, we present unprecedented organometallic functionalization via chromium carbonyl vapor exposure. This novel approach forms a pristine η⁶ bonding that preserves lattice planarity and interconnectivity between B- and N-centers, with the metal engaging each hBN ring. Computational analysis validates spontaneous surface reaction (ΔG = -35.50 kcal/mol). Further, carbonyl groups seed silver nanoparticle growth, culminating in a conductive layer atop hBN. This non-destructive, chemically versatile functionalization ushers in a new era in multifunctional coatings, harnessing hBN's thermal and structural prowess across diverse applications.