2009 Annual Meeting
(352c) Enhanced Conductivity and Melt Processing of Filled Polymer Composites through the Addition of A Low Melting Eutectic Metal
Authors
Randy A. Mrozek - Presenter, US Army Research Laboratory
Joseph L. Lenhart - Presenter, US Army Research Laboratory
Michael C. Berg - Presenter, U.S. Army Research Laboratories
Mark VanLandingham - Presenter, US Army Research Laboratory
Jan Andzelm - Presenter, U. S. Army Research Laboratory
Yelena Sliozberg - Presenter, U.S. Army Research Laboratory
Kenneth Strawhecker - Presenter, U.S. Army Research Laboratories
Phillip J. Cole - Presenter, Sandia National Laboratories
Conductive polymer materials have the potential to be utilized in many applications including sensors, energy storage devices, and robotics. However, conductivity that is inherent to the polymer or the result of added conductive filler typically reduces the ability to process the material and hinders its implementation into practical applications. We have investigated the addition of a eutectic metal that is molten at the melt processing temperature to have a minimal impact on the viscosity. After processing, the eutectic will remain solid over the entire anticipated operational temperature range. To successfully, incorporate high loadings of the eutectic metal into the polymer it was necessary to add a more traditional filler like nickel particulates. While the exact role of the filler is still being investigated, the amount of filler relative to eutectic can have a dramatic impact on the filler microstructure and resulting electrical performance of the material. This work is currently being transitioned from a glassy system to a flexible elastomer with a primary focus on the needs of the robotics community.