2008 Annual Meeting
(336a) Characterization of Pd-Based Membrane Fabricated by Surfactant Induced Electroless Plating (SIEP): Effect of Grain Size In Hydrogen Permeability
Authors
Polycrystalline palladium (Pd) was deposited on microporous stainless steel substrate using suitable surfactant in various concentrations in typical electroless plating formulation. To elucidate the role of surfactant in solid-liquid and solid-gas interface during grain coarsening, we used surfactant concentrations as in terms of critical micelle concentration (CMC). The microstructure of the Pd-film was characterized by Field Emission Scanning Electron Microscopy (FESEM), Energy Dispersive Spectroscopy (EDS) and X-ray diffraction (XRD). The type of surfactant (anionic, cationic and nonionic) and their relative CMCs greatly influence the grain size and surface morphology of the deposited Pd-film. We were successful in fabricating defect-free, thin Pd-film on microporous stainless steel substrate using a cationic surfactant. The surfactant molecules play an important role in the plating process in tailoring grain size and the process of agglomeration by removing tiny gas bubbles through adsorption at the gas-liquid interface. We studied the hydrogen permeability and selectivity for each of the membranes fabricated in this study at elevated temperature. Results show that membranes with agglomerated grains (finer grain size) possess relatively higher permeability and selectivity. In this presentation we will present some of these results along with a proposed deposition mechanism for SIEP.