2007 Annual Meeting
(607e) The Future of Smart Packaging and Rfid: The Path to Widespread Adoption (Panel Discussion)
Authors
Paul Rasband - Presenter, Vue Technologies
Jeff Lindsay - Presenter, Asia Pulp and Paper, China
Gary F. Madsen - Presenter, Kimberly-Clark Corp.
Vivek Subramanian - Presenter, University of California, Berkeley
Paul D. Fleming - Presenter, Western Michigan University
In spite of the many brilliant advances in RFID and smart packaging technology, there are challenges in identifying the proper business models to bring these technologies into widespread use. The five participants in this panel will share their insights into the future of these technologies and the pathway to adoption, and will answer questions from the audience.