2006 AIChE Annual Meeting
(37d) Interfacial Heat Transfer in Presence of Shear Flow
Authors
Khare, R. - Presenter, Texas Tech University
Keblinski, P., Rensselaer Polytechnic Institute
Yethiraj, A., University of Wisconsin
Thermal resistance at the interface between a polymer and a surface can play an important role in applications of materials such as nanocomposites. In this work, we use molecular dynamics simulations to study thermal resistance at a solid-liquid interface in the presence of a simple planar shear flow. Interfacial heat transfer properties of two model liquids a monoatomic liquid and a polymeric liquid (modeled using bead-spring chains) are studied when confined to nanoscopically thin films. The confining walls are modeled as FCC lattice surfaces and simulations are carried out at different strengths of the solid-liquid interaction (adsorbing or non-adsorbing walls). For both systems, the interfacial thermal resistance in the presence of shear flow was compared with a corresponding system but without the shear flow. We find that an interfacial slip in the velocity profile leads to an increase in the interfacial thermal resistance by about a factor of two, whereas in the absence of the velocity slip, the thermal resistance is not affected by the shear flow.